| Component | -Details | -|
|---|---|---|
| NXP® i.MX 8M Mini Processor | -4x Arm® Cortex®-A53 core platforms up to 1.8 GHz per core | -
- 32KB L1-I Cache -32 kB L1-D Cache -512 kB L2 Cache - |
-
| Arm® Cortex®-M4 core up to 400 MHz | -
- 16 kB L1-I Cache -16 kB L2-D Cache - |
- |
| 3D GPU (1x shader, OpenGL® ES 2.0) | -- | |
| 2D GPU | -- | |
| 1x MIPI DSI (4-lane) with PHY | -- | |
| 1080p60 VP9 Profile 0, 2 (10-bit) decoder, HEVC/H.265 decoder, AVC/H.264 Baseline, Main, High decoder, VP8 decoder | -- | |
| 1080p60 AVC/H.264 encoder, VP8 encoder | -- | |
| 5x SAI (12Tx + 16Rx external I2S lanes), 8ch PDM input | -- | |
| 1x MIPI CSI (4-lane) with PHY | -- | |
| 2x USB 2.0 OTG controllers with integrated PHY | -- | |
| 1x PCIe 2.0 (1-lane) with L1 low power substates | -- | |
| 1x Gigabit Ethernet (MAC) with AVB and IEEE 1588, Energy Efficient Ethernet (EEE) for low power | -- | |
| 4x UART (5mbps) | -- | |
| 4x I2C | -- | |
| 3x SPI | -- | |
| 4x PWM | -- | |
| STM32H747XI Microcontroller | -Arm® Cortex®-M7 core at up to 480 MHz with double-precision FPU | -16K data + 16K instruction L1 cache | -
| 1x Arm® 32-bit Cortex®-M4 core at up to 240 MHz with FPU, Adaptive real-time accelerator (ART Accelerator™) | -- | |
| Memory | -
- 2 MB of Flash Memory with read-while-write support -1 MB of RAM - |
- |
| Onboard memory | -NT6AN512T32AV | -2GB Low Power DDR4 DRAM | -
| FEMDRW016G | -16GB Foresee® eMMC Flash module | -|
| USB-C® | -High Speed USB | -- |
| DisplayPort output | -- | |
| Host and Device operation | -- | |
| Power Delivery support | -- | |
|
- High Density connectors - |
- 1 lane PCI express | -- |
| 1x 10/100/1000 Ethernet interface with PHY | -- | |
| 2x USB HS | -- | |
| 4x UART (2 with flow control) | -- | |
| 3x I2C | -- | |
| 1x SDCard interface | -- | |
| 2x SPI (1 shared with UART) | -- | |
| 1x I2S | -- | |
| 1x PDM input | -- | |
| 4 lane MIPI DSI output | -- | |
| 4 lane MIPI CSI input | -- | |
| 4x PWM outputs | -- | |
| 7x GPIO | -- | |
| 8x ADC inputs with separate VREF | -- | |
| Murata® 1DX Wi-Fi®/Bluetooth® Module | -Wi-Fi® 802.11b/g/n 65 Mbps | -- |
| Bluetooth® 5.1 BR/EDR/LE | -- | |
| NXP® SE050C2 Crypto | -Common Criteria EAL 6+ certified up to OS level | -- |
| RSA & ECC functionalities, high key length and future proof curves, such as brainpool, Edwards, and Montgomery | -- | |
| AES & 3DES encryption and decryption | -- | |
| HMAC, CMAC, SHA-1, SHA-224/256/384/512 operations | -- | |
| HKDF, MIFARE® KDF, PRF (TLS-PSK) | -- | |
| Support of main TPM functionalities | -- | |
| Secured flash user memory up to 50kB | -- | |
| I2C slave (High-speed mode, 3.4 Mbit/s), I2C master (Fast-mode, 400 kbit/s) | -- | |
| SCP03 (bus encryption and encrypted credential injection on applet and platform level) | -- | |
| ROHM BD71847AMWV Programmable PMIC | -Dynamic voltage scaling | -- |
| 3.3V/2A voltage output to carrier board | -- | |
| Temperature range | --40°C to +85°C | -It is user’s sole responsibility to test board's operation in full temperature - range. To improve the board performance in critical conditions, it is possible to attach external heatsinks on the processor and on the memory chip. | -
| Safety information | -Class A | -- |
| Component | +Details | +|
|---|---|---|
| NXP® i.MX 8M Mini Processor | +4x Arm® Cortex®-A53 core platforms up to 1.8 GHz per core | +
+ 32KB L1-I Cache +32 kB L1-D Cache +512 kB L2 Cache + |
+
| Arm® Cortex®-M4 core up to 400 MHz | +
+ 16 kB L1-I Cache +16 kB L2-D Cache + |
+ |
| 3D GPU (1x shader, OpenGL® ES 2.0) | ++ | |
| 2D GPU | ++ | |
| 1x MIPI DSI (4-lane) with PHY | ++ | |
| 1080p60 VP9 Profile 0, 2 (10-bit) decoder, HEVC/H.265 decoder, AVC/H.264 Baseline, Main, High decoder, VP8 decoder | ++ | |
| 1080p60 AVC/H.264 encoder, VP8 encoder | ++ | |
| 5x SAI (12Tx + 16Rx external I2S lanes), 8ch PDM input | ++ | |
| 1x MIPI CSI (4-lane) with PHY | ++ | |
| 2x USB 2.0 OTG controllers with integrated PHY | ++ | |
| 1x PCIe 2.0 (1-lane) with L1 low power substates | ++ | |
| 1x Gigabit Ethernet (MAC) with AVB and IEEE 1588, Energy Efficient Ethernet (EEE) for low power | ++ | |
| 4x UART (5mbps) | ++ | |
| 4x I2C | ++ | |
| 3x SPI | ++ | |
| 4x PWM | ++ | |
| STM32H747XI Microcontroller | +Arm® Cortex®-M7 core at up to 480 MHz with double-precision FPU | +16K data + 16K instruction L1 cache | +
| 1x Arm® 32-bit Cortex®-M4 core at up to 240 MHz with FPU, Adaptive real-time accelerator (ART Accelerator™) | ++ | |
| Memory | +
+ 2 MB of Flash Memory with read-while-write support +1 MB of RAM + |
+ |
| Onboard memory | +NT6AN512T32AV | +2GB Low Power DDR4 DRAM | +
| FEMDRW016G | +16GB Foresee® eMMC Flash module | +|
| USB-C® | +High Speed USB | ++ |
| DisplayPort output | ++ | |
| Host and Device operation | ++ | |
| Power Delivery support | ++ | |
|
+ High Density connectors + |
+ 1 lane PCI express | ++ |
| 1x 10/100/1000 Ethernet interface with PHY | ++ | |
| 2x USB HS | ++ | |
| 4x UART (2 with flow control) | ++ | |
| 3x I2C | ++ | |
| 1x SDCard interface | ++ | |
| 2x SPI (1 shared with UART) | ++ | |
| 1x I2S | ++ | |
| 1x PDM input | ++ | |
| 4 lane MIPI DSI output | ++ | |
| 4 lane MIPI CSI input | ++ | |
| 4x PWM outputs | ++ | |
| 7x GPIO | ++ | |
| 8x ADC inputs with separate VREF | ++ | |
| Murata® 1DX Wi-Fi®/Bluetooth® Module | +Wi-Fi® 802.11b/g/n 65 Mbps | ++ |
| Bluetooth® 5.1 BR/EDR/LE | ++ | |
| NXP® SE050C2 Crypto | +Common Criteria EAL 6+ certified up to OS level | ++ |
| RSA & ECC functionalities, high key length and future proof curves, such as brainpool, Edwards, and Montgomery | ++ | |
| AES & 3DES encryption and decryption | ++ | |
| HMAC, CMAC, SHA-1, SHA-224/256/384/512 operations | ++ | |
| HKDF, MIFARE® KDF, PRF (TLS-PSK) | ++ | |
| Support of main TPM functionalities | ++ | |
| Secured flash user memory up to 50kB | ++ | |
| I2C slave (High-speed mode, 3.4 Mbit/s), I2C master (Fast-mode, 400 kbit/s) | ++ | |
| SCP03 (bus encryption and encrypted credential injection on applet and platform level) | ++ | |
| ROHM BD71847AMWV Programmable PMIC | +Dynamic voltage scaling | ++ |
| 3.3V/2A voltage output to carrier board | ++ | |
| Temperature range | +-40°C to +85°C | +It is user’s sole responsibility to test board's operation in full temperature + range. To improve the board performance in critical conditions, it is possible to attach external heatsinks on the processor and on the memory chip. | +
| Safety information | +Class A | ++ |